viaSingleEnded
Description
Use the viaSingleEnded
object to create a single-ended via model
within a printed circuit board (PCB) stack.
A vertical interconnect access (via) is an essential part of a multilayer PCB. You can use vias to create an electrical connection between the different layers in a PCB. You can construct vias by placing copper pads on each layer of the PCB and drilling a hole through the pads, using a non-conductive material in the inner layer of the via and a conductive plating on the outer layer.
A via consists of:
Barrel — Conductive tube filling the drilled hole
Pad — Connects each end of the barrel to a component, plane, or trace
Antipad — Clearance hole between the barrel and metal layer
In a multilayer PCB, vias reduce the length over which you need to route a trace to complete its connection. Smaller the via, the better the performance of the circuit.
Note
In this release, viaSingleEnded
only supports behavioral model analysis
of s-parameters. For more information, see Behavioral Models.
Creation
Syntax
Description
via = viaSingleEnded
creates a single-ended via with default
properties. This via has one dielectric layer, two ground layers, one signal via, and
one ground return via.
via = viaSingleEnded(number of dilectric layers)
returns a
single-ended via based on the number of dielectric layers.
via = viaSingleEnded(
sets
Properties using one or more
name-value arguments. For example, Name=Value
)viaSingleEnded(ViaDiameter=0.0065)
creates a single-ended via with a diameter of 0.0065
meters.
Properties not specified retain their default values
Properties
Object Functions
criticalwavelength | Number of wavelengths between signal via and ground return vias |
gapratedistance | Gap rate distance metric |
layout | Plot all metal layers and board shape |
shapes | Extract all metal layer shapes of PCB component |
show | Display PCB component structure or PCB shape |
sparameters | Calculate S-parameters for RF PCB objects |
Examples
References
[1] Steinberger, Telian, Tsuk, Iyer and Yanamadala, “Proper Ground Via Placement for 40+ Gbps Signaling”, DesignCon 2022, April 2022.
[2] Ramo, Whinnery and Van Duzer, Fields and Waves in Communications Electronics, third edition, section 9.3, John Wiley and Sons Inc., copyright 1994
Version History
Introduced in R2023a